Course record ME

ME 4754

Electronics Packaging Assembly, Reliability, Thermal Management, and Test

Georgia Institute of Technology-Main Campus

16 sections3 professors
Grades: 2011–2025Evaluations: 2012–2023
Flunk Score19/100
Needs work

Professors 3 of 3

Rao Tummala 6 sections · 6 terms · 2011–2016 3.54GPA
62.5% A
29.2% B
8.3% C
0.0% D
0.0% F

Published grade shares · 6 sections · 2011–2016

Compare with the course
Tummala vs. the course average
A +5.5
B −2.9
C +0.7
D −3.3
F same

Difference in percentage points.

Each term against the course average
Spring 2011Spring 2016
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Vanessa Smet 4 sections · 4 terms · 2022–2025 3.50GPA
54.0% A
41.8% B
4.3% C
0.0% D
0.0% F

Published grade shares · 4 sections · 2022–2025

Compare with the course
Smet vs. the course average
A −3.0
B +9.7
C −3.4
D −3.3
F same

Difference in percentage points.

Each term against the course average
Spring 2022Spring 2025
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C Wong 6 sections · 5 terms · 2017–2021 3.25GPA
53.2% A
28.1% B
9.4% C
9.4% D
0.0% F

Published grade shares · 6 sections · 2017–2021

Compare with the course
Wong vs. the course average
A −3.9
B −4.0
C +1.7
D +6.1
F same

Difference in percentage points.

Each term against the course average
Spring 2017Spring 2021
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