Course record ECE

ECE 6779

Thermal Engineering for Packaging of Micro and Nano Systems

Georgia Institute of Technology-Main Campus

4 sections1 professor
Grades: 2012–2021Evaluations: 2017

Latest dated data is over 4 years old.

Flunk Score21/100
Below average

Grade record

ECE 6779
3.45
average GPA across 4 sections
93%
A or B
23.8%
D, F or withdrew
51.5%
A
42.0%
B
6.6%
C
23.8%
W
This school publishes shares, not head counts. The percentages are real. There is no student count to show.

How the averages compare

Against other ECE courses, and against the university

  • 3.45ECE 6779
  • 3.60ECE courses
  • 3.63School average
Average GPA · Zoomed GPA scale
Lower averageHigher average
Every term against the 3.45 average 4 terms
Fall 2012Fall 2021
4 sections · 4 terms · Fall 2012 – Fall 2021
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